Fraunhofer is Europe’s largest application-oriented research organization located in Germany. With decades of experience, they have many advanced technologies in semiconductor technology, devices and packaging.

• Provides the design, sample and processing of silicon carbide power electronic devices.

• Provide 2.5D and 3D packaging design and processing technology. Such as RDL, bump fabrication, TSV process and so on.

For detail please contact our expert:

Info@dehongmp.com